Leetop-FLAME EBOX

Leetop-FLAME-ENX is an embedded artificial intelligence computer capable of empowering many end devices with up to 21TOPS of computing power. leetop-FLAME-ENX offers a fast passive thermal design that can meet industrial standards such as anti-vibration and anti-static. Meanwhile, Leetop-FLAME-ENX is rich in interfaces and cost-effective.

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Product features

Product function

产品规格 Specifications

处理器模组 Processor

Processor

NVIDIA Jetson Xavier NX

NVIDIA Jetson NanoNVIDIA Jetson Orin NX
AI Performance21 TOPS (INT8)472 GFLOPs

Up to 100 (S) INT8 TOPs and 50

(D) INT8 TOPs

GPU

384-core NVIDIA

Volta™ GPU with 48

Tensor Cores

NVIDIA Maxwell

architecture with 128

NVIDIA CUDA® cores

NVIDIA Ampere Architecture with

1024

NVIDIA CUDA cores and 32 Tensor

cores

GPU Max

Freq

1100 MHz
1 GHz
CPU

6-core NVIDIA Carmel

ARM®v8.2 64-bit CPU

6MB L2 + 4MB L3

Quad-core ARM Cortex-

A57 MPCore processor

8-core NVIDIA A78 CPU

CPU Max

Freq

2-core @ 1900MHz

4/6-core @ 1400Mhz


2 GHz
Memory

8 GB 128-bit LPDDR4x

@ 1866MHz

59.7GB/s

4 GB 64-bit LPDDR4,

1600MHz

25.6 GB/s

12 GB, 102 GB/s
Storage16 GB eMMC 5.116 GB eMMC 5.1External (i.e. NVMe using x1 PCIe)
Power10W|15W|20W5W |10W10W|15W|25W
PCIe

1 x1 + 1x4

(PCIe Gen3, Root Port

& Endpoint)

1 x4

(PCIe Gen2)

3 x1 + 1 x4 or 2 x1 + 1 x2 + 2 x4,

all Gen4. x1

and x2 support Root Port only. x4

supports

CSI Camera

Up to 6 cameras (36 via

virtual channels)

12 lanes MIPI CSI-2

D-PHY 1.2 (up to 30

Gbps)

Up to 4 cameras

12 lanes MIPI CSI-2

D-PHY 1.1 (up to 18 Gbps)

8 lanes (2x4 or 4x2) MIPI CSI-2

D-PHY 1.2 (2.5 Gb/s per pair)

Video

Encode

2x 4K60 |4x 4K30 |10x

1080p60 |

22x 1080p30 (H.265)

2x 4K60 |4x 4K30 |10x

1080p60 |

20x 108p30 (H.264)

250MP/sec

1x 4K @ 30 (HEVC)

2x 1080p @ 60 (HEVC)

4x 1080p @ 30 (HEVC)

4x 720p @ 60 (HEVC)

9x 720p @ 30 (HEVC)

AV1

1x8K30 2x4K60 4x4K30

9x1080p60 18x1080p30

H.265

1x8K30 2x4K60 6x4K30

12x1080p60 24x1080p30

H.264

1x4K60 2x4K30 6x1080p60

12x1080p30

VP9 24x1080p30

Video

Decode

2x 8K30 |6x 4K60 |12x

4K30 |

22x 1080p60 |44x

1080p30 (H.265)

2x 4K60 |6x 4K30 |10x

1080p60 |22x 1080p30

(H.264)

2 x4K30 |6x1080p60

|14x1080p30(VP9)


(AV1)1x4K30 |3x1080p60

|6x1080p30

(H.264/H.264)1x4K60 |2x4K30

|6x1080p60 |14x1080p30

Display

2 multi-mode DP

1.4/eDP 1.4/HDMI 2.0

HDMI 2.0 and eDP 1.4

One multi-mode (8K60, 2x4K60),

(e)DP 1.4 (HBR3, MST, DSCT),

HDMI™ 2.1

DL

Accelerator

2x NVDLA Engines
2x NVDLA Engines, v2

Vision

Accelerator

7-Way VLIW Vision

Processor


7-Way VLIW Vision Processor, v2
Networking

10/100/1000 BASE-T

Ethernet

10/100/1000 BASE-T

Ethernet

10/100/1000 Mbit


接口 I/O

FeatureA205 E Carrier for NVIDIA Jetson NX
Module CompatibilityNVIDIA Jetson NX
PCB Size / Overall Size115mm x 105mm
Display2x HDMI
Ethernet2x Gigabit Ethernet (10/100/1000)
USB4x USB 3.0 Type A (Integrated USB 2.0) 1x USB 2.0 Type C
M.2 KEY M1x M.2 KEY M Interface
Camera120P摄像头接口
TF_CARD1x TF_CARD
USB 2.0ZIF 20P 0.5mm pitch
SPI Bus1X SPI Bus(+3.3V Level)
FAN1 x FAN(5V PWM)
CAN1x CAN, 1CAN 收发器
RS4851 x RS485
RS2321 x RS232
Misc.2x I2C Link(+3.3V I/O) 1X SPI Bus(+3.3V Level) 2x LED STATE
Power Requirements+9---+36V DC Input @ 8A
Operating Temperature-25 o C to +80 o C
Warranty and Support Accessories1 Year Warranty and Free Support


供电 Power Supply

Power SupplySpecification
Input TypeDC
Input Voltage+9---+36V DC Input @ 8A
Typical consumption30W


结构 Mechanical

MechanicalSpecification
Dimensions (W x H x D)209.0mm x 68.3mm x 130.0mm
Weight1.6kg


环境 Environmental

EnvironmentalSpecification
Operating Temperature-20℃-60℃, 0.2~0.3m/s air flow
Storage Temperature-25℃ ~ +80℃
Storage Humidity10%-90% 非结露环境 non-condensing


结构尺寸及安装 Install Dimension

Leetop-FLAME-ENX主体尺寸如下图所示:

Dimensions as below:

image.png

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