GE KIT
ProcessorNVIDIA Jetson AGX XavierNVIDIA Jetson AGX OrinAI Performance32 TOPsUp to 200 Sparse TOPS (INT8) GPU 512-core Volta GPU with 64 Tensor Cores 11 TFLOPS (FP16) 22 TOPS (INT8)2 GPC/ 8 TPC/MIG/204
Product features
Product function
Leetop GE KIT Carrier Board Nvidia Jetson Xavier / Orin
Take supercomputer performance to the edge.
Small Size. Small Price. Big AI Discoveries.
Today’s Autonomous Machines and Edge Computing systems are defined by the growing needs of AI software. Fixed function devices running simple convolutional neural networks for inferencing tasks like object detection and classification are not able to keep up with new networks that appear every day: transformers are important for natural language processing for service robots; reinforcement learning is needed for manufacturing robots that might need to operate alongside humans; and autoencoders, long short-term memory (LSTM), and generative adversarial networks (GAN) are needed for various applications.
The NVIDIA® Jetson™ platform is the ideal solution to solve the needs of these complex AI systems at the edge. The platform includes Jetson modules, which are small form-factor, high-performance computers, the JetPack SDK for end-to-end AI pipeline acceleration, and an ecosystem with sensors, SDKs, services, and products to speed up development. Jetson is powered by the same AI software and cloud-native workflows used across other NVIDIA platforms and delivers the performance and power-efficiency customers need to build software-defined intelligent machines at the edge. For advanced robotics and other autonomous machines in the fields of manufacturing, logistics, retail, service, agriculture, smart city, and healthcare the Jetson platform is the ideal solution.
Interface
Interface | Specification | |
Network | 1 x Gigabit Ethernet Connector (10/100/1000) | |
Video Output | 1 x HDMI 2.0 (TYPE A) | |
USB | 2x USB 3.0 Type A (Integrated USB 2.0)/1x USB 3.0/USB 2.0 Micro-AB | |
M.2 KEY E PCIE | Wifi + Bluetooth | |
M.2 KEY M | 1x M.2 KEY M (NVMe SSD) | |
PCIE | x8 PCIe 4.0 controller | |
Camera | CAMERA Esp.conn | |
Misc. | 1x I2S(3.3V Level);2x I2C Link (+3.3V I/O);5x GPIO;1x UART;2x SPI | |
Power Requirements | +9V to +19V DC Input @ 3A |
KEY FEATURES
Processor | NVIDIA Jetson AGX Xavier | NVIDIA Jetson AGX Orin |
AI Performance | 32 TOPs | Up to 200 Sparse TOPS (INT8) |
GPU |
512-core Volta GPU with 64 Tensor Cores 11 TFLOPS (FP16) 22 TOPS (INT8) | 2 GPC/ 8 TPC/MIG/2048 NVIDIA® CUDA® cores / 64 Tensor cores Ray-Tracing cores/ End-to-end lossless compression / Tiled Caching / OpenGL® 4.6+ / OpenGL ES 3.2/ Vulkan™ 1.2+◊/ |
GPU Max Freq | 2200 MHz | 1 GHz |
CPU | 8-core Carmel ARM v8.2 64-bit CPU, 8MB L2 + 4MB L3 | Arm Cortex-A78AE |
CPU Max Freq | 4-core @ 2200MHz 6/8-core @ 1400MHz | 2 GHz |
Memory | 32GB 256-Bit LPDDR4x |136.5GB/s | 32 GB 256-bit LPDDR5 DRAM |
Storage | 32GB eMMC 5.1 | 64 GB eMMC 5.1 64 MB NOR Boot Flash 8 MB NOR Secure Key Flash |
Power | 10W |15W |30W | 5V and 20V |
PCIe | 1 x8 + 1 x4 + 1 x2 + 2 x1 (PCIe Gen4, Root Port & Endpoint) | PCI Express 4.0 x1, x2, x4 and x8 Up to 3x Endpoint supported |
CSI Camera | Up to 6 cameras (36 via virtual channels) 16 lanes MIPI CSI-2 |8 lanes SLVS-EC D-PHY 1.2 (up to 40 Gbps) C-PHY 1.1 (up to 62 Gbps) |
16×: CSI Lanes D-PHY v2.1 |
Video Encode | 2x1000MP/sec 4x 4K @ 60 (HEVC) 8x 4K @ 30 (HEVC) 16x 1080p @ 60 (HEVC) 32x 1080p @ 30 (HEVC) | 2×: 4K60 (H.265) /1x: 8K30 (H.265) |
Video Decode | 2x1500MP/sec 2x 8K @ 30 (HEVC) 6x 4K @ 60 (HEVC) 12x 4K @ 30 (HEVC) 26x 1080p @ 60 (HEVC) 52x 1080p @ 30 (HEVC) 30x 1080p @ 30 (H.264) |
2×: 4K60 (H.265) /1x: 8K30 (H.265) |
Display | 3 multi-mode DP 1.4/eDP 1.4/HDMI 2.0 No DSI support | 1×: shared HDMI™ 2.0, eDP1.4, VESA® DisplayPort™ (DP) HBR3 |
DL Accelerator | (2x) NVDLA Engines* |5 TFLOPS (FP16), 10 TOPS (INT8) | Deep Learning Accelerator (DLA) / Up to 90 INT8 TOPS (Deep Learning Inference) / 2MB dedicated SRAM |
Vision Accelerator |
7-way VLIW Vision Processor* | Programmable Vision Accelerator (PVA) / Up to 512 INT16 GMACS or 2048 INT8 GMACS / 2MB dedicated SRAM |
Networking | 10/100/1000 BASE-T Ethernet | RGMII |
Mechanical | 100 mm x87 mm 699-pin connector Integrated Thermal Transfer Plate | 100.0 mm x 87.0 mm x 16.0 mm 699 pin B2B Connector Integrated Thermal Transfer Plate (TTP) with Heatpipe |
Install Dimension
