产品简介:
Product introduction:
Leetop_A608是基于英伟达Orin NANO/Orin NX核心板 研发一款高性能载板。Leetop_A608载板具有丰富的接口, 并能为的众多终端设备赋予高达20/40/70/100TOPS算力。此 外Leetop_A608提供丰富的外围接口。符合抗震防静电等工 业标准。
Leetop_A608 is a high-performance carrier board developed based on the NVIDIA Orin NANO/Orin NX core module. Leetop_ A608 carrier board has rich interfaces and can provide up to 20/40/70/100TOPS computing power for numerous terminal devices. In addition, Leetop_A608 provides rich peripheral interfaces. Comply with industrial standards such as earthquake resistance and anti-static.
产品规格 Product specification:
处理器模块 Processor module:
Jetson Orin NX 8GB | Jetson Orin NX 16GB | |
AI Performance | 70 TOPS | 100 TOPS |
GPU | 1024-core NVIDIA Ampere GPU with 32 Tensor Cores | |
CPU | 6-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core NVIDIA Arm ® Cortex A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
Video Encode | 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
Video Decode | 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
Memory | 8 GB 128-bit LPDDR5 102.4 GB/s | 16 GB 128-bit LPDDR5 102.4 GB/s |
Storage | — (Supports external NVMe) |
Jetson Orin Nano 4GB | Jetson Orin Nano 8GB | |
AI Performance | 20TOPS | 40TOPS |
GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | |
Video Encode | 1080p30 supported by 1-2 CPU cores | |
Video Decode | 1x 4K60 (H.265) 2x4K30 (H.265) 5x1080p60 (H.265) 11x1080p30 (H.265) | |
Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s |
Storage | — (Supports external NVMe) |
产品规格 :
Product specification:
Feature | Specification |
Module Compatibility | Jetson Orin NANO/Orin NX |
Display | 1x DP |
Ethernet | 2x Gigabit Ethernet (10/100/1000) |
USB | 4x USB 3.2 Type A (Integrated USB 2.0) 1x USB 2.0+3.2 Type C |
M.2 KEY M | 1xM.2KEY M(SSD) Interface 1xM.2KEY E(WIFI) Interface 1xM.2 KEY B(4G/5G) Interface |
Camera | 2xCSI Camera |
FAN | 1xFAN(5V PWM) |
RTC CON | 1x 3.0V RTC |
CAN | 1xCAN (FD) |
Audio | 1x3.5 Audio Jack; 2X MIC; 2X SPEAKER; 1X SPEAKER FEEDBACK |
Function CON | 2X IIC; 1X SPI; 7X IO 3.3V; 2x UART; 1X DEBUG; 1X POWER; 1X RESET; 1X RECOVERY |
DC | Power interface |
产品规格 :
Product specification:
Project | Spec |
Input Voltage | +9-- +20V(MAX 60W) DC Input |
Load capacity | Above 60W |
Dimensions (W×D ×H) | 101.5x95 (mm) |
Operating Temperature | -25℃-65 ℃ |
Storage Temperature/ Humidity | -25℃-65℃ 10% -90% Non condensation environment |
Weight | 0.10075KG |