Product features
Product function
产品简介：
Product introduction:
Leetop_LHR-D5241F是一款高性能整机，采用了Leetop_ B100载板设计，并搭载了强大的RDK X3模组，拥有高达5 Tops的推理算力。搭载4核ARM Cortex®A53处理器，为用户提 供卓越的计算性能。支持可拆卸式外壳串口调试，适用于各种调 试场景。此外，Leetop_LHR-D5241F配备了4个USB 3.0接口和 2个USB 2.0接口，提供多样化的外设连接选项，满足各类场景的 使用需求。同时，它还提供主动散热，满足用户的散热需求。
Leetop_LHR-D5241F is a high-performance machine that adopts the Leetop_B100 carrier board design and is equipped with the powerful RDK X3 module, with an inference computing power of up to 5 Tops. Equipped with an 4-core ARM Cortex®A53 processor, it provides users with excellent computing performance. Supports detachable housing serial port debugging, suitable for various debugging scenarios. In addition, Leetop_LHR-D5241F is equipped with 4 USB 3.0 interfaces and 2 USB 2.0 interfaces, providing a variety of peripheral connection options to meet the needs of various scenarios. At the same time, it also provides active cooling to meet users’ cooling needs.
产品规格 ：
Product specification ：
| Project | Sp ecification |
| Module Compa tibility | RDK X3 Moudle |
| Displa y | 1x HDMI |
| Et hernet | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 2x USB 2.0(1xDebug;1xMicro USB |
| Audio | 1x Audio jack |
| Camera | 3x CSI Camera |
| DC | Power interface |
| Input Voltage | 12V(MAX 35W) DC Input |
| Load capacity | Above 35W |
| Structure size | 116x88.7x44.6(mm) |
| Operating Temperature | -20℃-60℃ |
产品规格 Product specification：
处理器模块 Processor module：
RDK X3 Moudle 主要包含四核Cortex®A53处理器、5Tops算力、最高4GB内存且支持4K@60帧视频编解；主要接口包括 HDMI、千兆以太网、USB 3.0、USB2.0、MIPI CSI、UART Debug、TF 卡接口等。
模组搭载双频 2.4/5.0GHz 无线局域网和蓝牙 4.2 模块，单板上已具备 PCB 天线，同时也可以搭配外部天线套件使用，能够实现无线连接，降低用户开发和 测试成本，缩短上市时间。
RDK X3 Module 可选的板载 RAM 容量包括 2GB、4GB。
RDK X3 Moudle mainly includes a quad-core Cortex® A53 processor, 5Tops computing power, up to 4GB memory and supports 4K@60 frame video encoding and decoding; the main interfaces include HDMI, Gigabit Ethernet, USB 3.0, USB2.0, MIPI CSI, UART Debug, TF card interface, etc.
The module is equipped with dual-band 2.4/5.0GHz wireless LAN and Bluetooth 4.2 modules. The board already has a PCB antenna and can also be used with an external antenna kit to achieve wireless connections, reduce user development and testing costs, and shorten time to market.
The optional onboard RAM capacities of RDK X3 Module include 2GB and 4GB.
尺寸示意图：
Dimensional diagram：
| 正视图 Front view | 左视图 Left view |
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| 俯视图 Top view | 底部视图 Bottom view |
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