Jetson Agx Orin

The world's most powerful AI computer built for energy-efficient autonomous machines powers your next-generation product. Compared to the previous generation, it can achieve 6 times the performance and 200 TOPS of computing power for multiple concurrent AI inference pipelines, and high-speed interface support for multiple sensors, and is suitable for applications in manufacturing, logistics, retail and healthcare ideal solution。

Built for the next generation of AI products

  • size
  • performance
  • power

Compact form factor with improved performance

Measuring 100mm x 87mm, the Jetson AGX Orin™ offers up to 6 times the performance in the same compact form factor compared to the Jetson AGX Xavier. This makes it the solution of choice for the new generation of autonomous machines such as distribution and logistics robots, factory systems and large industrial UAVs.

High performance for autonomous machines

Jetson AGX Orin features NVIDIA Ampere architecture GPU and Arm® Cortex®-A78AE CPU, as well as next-generation deep learning and vision accelerators. High-speed IO, 204GB/s of memory bandwidth, and 32GB of DRAM can feed multiple concurrent AI application pipelines. With Jetson AGX Orin, you can now deploy larger, more complex models addressing problems such as natural language understanding, 3D perception, and multi-sensor fusion.

Select power consumption

Jetson AGX Orin provides higher performance for autonomous machines in an energy efficient system. The module consumes only 15 watts, capped at 50 watts, and is form factor and pin compatible with the Jetson AGX Xavier, while delivering up to 6x the performance. NVIDIA Jetson AGX Orin with NVIDIA JetPack™ and NVIDIA AI Software Stack is your next-generation AI product platform.


Jetson AGX Orin Module Specifications




Jetson AGX Orin 32GB

Jetson AGX Orin 64GB

Jetson AGX Orin 开发者套件
AI 性能200 TOPS275 TOPS
GPU搭载 56 个 Tensor Core 的 1792 核 NVIDIA Ampere 架构 GPU搭载 64 个 Tensor Core 的 2048 核 NVIDIA Ampere 架构 GPU
GPU 最大频率930 MHz1.3 GHz
CPU8 核 Arm® Cortex®-A78AE v8.2 64 位 CPU
2MB L2 + 4MB L3
12 核 Arm® Cortex®-A78AE v8.2 64 位 CPU
3MB L2 + 6MB L3
CPU 最大频率2.2 GHz
DL 加速器2x NVDLA v2
DLA 最大频率1.4 GHz1.6 GHz
视觉加速器1x PVA v2
安全集群引擎-
显存

32GB 256 位 LPDDR5
204.8GB/s

64 GB 256 位 LPDDR5
204.8GB/s

32GB 256 位 LPDDR5
204.8GB/s
存储64GB eMMC 5.1
视频编码1x 4K60 (H.265)

3x 4K30 (H.265)

6x 1080p60 (H.265)

12x 1080p30 (H.265)

2x 4K60 (H.265)
4x 4K30 (H.265)
8x 1080p60 (H.265)
16x 1080p30 (H.265)
视频解码1x 8K30 (H.265)

2x 4K60 (H.265)

4x 4K30 (H.265)

9x 1080p60 (H.265)

18x 1080p30 (H.265)

1x 8K30 (H.265)
3x 4K60 (H.265)
7x 4K30 (H.265)
11x 1080p60 (H.265)
22x 1080p30 (H.265)
摄像头多达 6 个摄像头(通过虚拟通道最多可支持 16 个)
16 通道 MIPI CSI-2
D-PHY 2.1(高达 40Gbps)| C-PHY 2.0(高达 164Gbps)
16 通道 MIPI CSI-2 连接器
PCIe*高达 2 x8 + 1 x4 + 2 x1
(PCIe 4.0,根端口和端点)
支持 x8 PCIe 4.0 的 x16 PCIe 插槽
支持 x4 PCIe 4.0 的 M.2 Key M 插槽
支持 x1 PCIe 4.0 的 M.2 Key E 插槽
USB*3x USB 3.2 2.0 (10 Gbps)
4x USB 2.0
USB Type-C 连接器:2x USB 3.2 2.0
USB Type-A 连接器:2x USB 3.2 2.0,2x USB 3.2 1.0
USB Micro-B 连接器:USB 2.0
网络*1x GbE
1x 10GbE
RJ45 连接器,至高可支持 10 GbE
显示接口1x 8K60 多模 DP 1.4a (+MST)/eDP 1.4a/HDMI 2.11x DisplayPort 1.4a (+MST) 连接器
其他 I/O4x UART、3x SPI、4x I2S、8x I2C、2x CAN、PWM、DMIC 和 DSPK、GPIO40 针接头(UART、SPI、I2S、I2C、CAN、PWM、DMIC、GPIO)
12 针自动化接头
10 针音频面板接头
10 针 JTAG 接头
4 针风扇接头
2 针 RTC 电池备份连接器
microSD 插槽
直流电源插座
电源、强制恢复和复位按钮
功耗15 瓦至 40 瓦15 瓦 – 60 瓦
规格尺寸100 毫米 x 87 毫米
699 引脚 Molex Mirror Mezz 连接器
集成导热板
110 毫米 x 110 毫米 x 71.65 毫米
(高度包括支架、载板、模组和散热解决方案)


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