The world's most powerful AI computer built for energy-efficient autonomous machines powers your next-generation product. Compared to the previous generation, it can achieve 6 times the performance and 200 TOPS of computing power for multiple concurrent AI inference pipelines, and high-speed interface support for multiple sensors, and is suitable for applications in manufacturing, logistics, retail and healthcare ideal solution。
Measuring 100mm x 87mm, the Jetson AGX Orin™ offers up to 6 times the performance in the same compact form factor compared to the Jetson AGX Xavier. This makes it the solution of choice for the new generation of autonomous machines such as distribution and logistics robots, factory systems and large industrial UAVs.
Jetson AGX Orin features NVIDIA Ampere architecture GPU and Arm® Cortex®-A78AE CPU, as well as next-generation deep learning and vision accelerators. High-speed IO, 204GB/s of memory bandwidth, and 32GB of DRAM can feed multiple concurrent AI application pipelines. With Jetson AGX Orin, you can now deploy larger, more complex models addressing problems such as natural language understanding, 3D perception, and multi-sensor fusion.
Jetson AGX Orin provides higher performance for autonomous machines in an energy efficient system. The module consumes only 15 watts, capped at 50 watts, and is form factor and pin compatible with the Jetson AGX Xavier, while delivering up to 6x the performance. NVIDIA Jetson AGX Orin with NVIDIA JetPack™ and NVIDIA AI Software Stack is your next-generation AI product platform.
Jetson AGX Orin 32GB | Jetson AGX Orin 64GB | Jetson AGX Orin 开发者套件 | |
AI 性能 | 200 TOPS | 275 TOPS | |
GPU | 搭载 56 个 Tensor Core 的 1792 核 NVIDIA Ampere 架构 GPU | 搭载 64 个 Tensor Core 的 2048 核 NVIDIA Ampere 架构 GPU | |
GPU 最大频率 | 930 MHz | 1.3 GHz | |
CPU | 8 核 Arm® Cortex®-A78AE v8.2 64 位 CPU 2MB L2 + 4MB L3 | 12 核 Arm® Cortex®-A78AE v8.2 64 位 CPU 3MB L2 + 6MB L3 | |
CPU 最大频率 | 2.2 GHz | ||
DL 加速器 | 2x NVDLA v2 | ||
DLA 最大频率 | 1.4 GHz | 1.6 GHz | |
视觉加速器 | 1x PVA v2 | ||
安全集群引擎 | - | ||
显存 | 32GB 256 位 LPDDR5 | 64 GB 256 位 LPDDR5 | 32GB 256 位 LPDDR5 204.8GB/s |
存储 | 64GB eMMC 5.1 | ||
视频编码 | 1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) | 2x 4K60 (H.265) 4x 4K30 (H.265) 8x 1080p60 (H.265) 16x 1080p30 (H.265) | |
视频解码 | 1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) | 1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265) | |
摄像头 | 多达 6 个摄像头(通过虚拟通道最多可支持 16 个) 16 通道 MIPI CSI-2 D-PHY 2.1(高达 40Gbps)| C-PHY 2.0(高达 164Gbps) | 16 通道 MIPI CSI-2 连接器 | |
PCIe* | 高达 2 x8 + 1 x4 + 2 x1 (PCIe 4.0,根端口和端点) | 支持 x8 PCIe 4.0 的 x16 PCIe 插槽 支持 x4 PCIe 4.0 的 M.2 Key M 插槽 支持 x1 PCIe 4.0 的 M.2 Key E 插槽 | |
USB* | 3x USB 3.2 2.0 (10 Gbps) 4x USB 2.0 | USB Type-C 连接器:2x USB 3.2 2.0 USB Type-A 连接器:2x USB 3.2 2.0,2x USB 3.2 1.0 USB Micro-B 连接器:USB 2.0 | |
网络* | 1x GbE 1x 10GbE | RJ45 连接器,至高可支持 10 GbE | |
显示接口 | 1x 8K60 多模 DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 | 1x DisplayPort 1.4a (+MST) 连接器 | |
其他 I/O | 4x UART、3x SPI、4x I2S、8x I2C、2x CAN、PWM、DMIC 和 DSPK、GPIO | 40 针接头(UART、SPI、I2S、I2C、CAN、PWM、DMIC、GPIO) 12 针自动化接头 10 针音频面板接头 10 针 JTAG 接头 4 针风扇接头 2 针 RTC 电池备份连接器 microSD 插槽 直流电源插座 电源、强制恢复和复位按钮 | |
功耗 | 15 瓦至 40 瓦 | 15 瓦 – 60 瓦 | |
规格尺寸 | 100 毫米 x 87 毫米 699 引脚 Molex Mirror Mezz 连接器 集成导热板 | 110 毫米 x 110 毫米 x 71.65 毫米 (高度包括支架、载板、模组和散热解决方案) |
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