Product features
Product function
产品简介：
Product introduction：
Leetop_B100是基于RDK X3模组设计的一款全功能开 发板。是一款其具丰富外设接口，高性能的智能载板。RDK X3模组搭载地平线旭日®3系列高性能的智能芯片，提供强 大的端侧通用与人工智能算力。
Leetop_B100 is a full-featured development board designed based on the RDK X3 module. It is an intelligent carrier board with rich peripheral interfaces
and high performance.The RDK X3 module is equipped with Horizon Rising Sun® 3 series high- performance smart chips, providing powerful end-side general-purpose and artificial intelligence computing power.
产品规格 ：
Product specification：
| Project | Specification |
| Module Compatibility | RDK X3 Moudle |
| Display | 1x HDMI |
| Ethernet | 1x Gigabit Ethernet (10/100/1000) |
| USB | 4x USB 3.0 2x USB 2.0(1xDebug;1xMicro USB |
| Audio | 2x SPEAKER; 1x Audio jack |
| Camera | 3x CSI Camera(2x2_lane; 1x4_lane) |
| FAN | 1xFAN(5V PWM) |
| RTC CON | 1x3.0V RTC |
| Function con | 11x GPIO; 1x I2C; 1xSPI; 1x SPK_R; 1x SPK_L |
| DC | Power interface |
| Input Voltage | 12V(MAX 35W) DC Input |
| Load capacity | Above 35W |
| Dimensions (W×D ×H) | 100X79 (mm) |
| Operating Temperature | -20℃-60℃ |
Storage Temperature Humidit | -20℃-60℃ 10% -90% Non condensation environment |
| Weight | 0.0587KG |
产品规格 Product specification：
处理器模块 Processor module：
RDK X3 Moudle 主要包含四核Cortex®A53处理器、5Tops算力、最高4GB内存且支持4K@60帧视频编解；主要接口包括 HDMI、千兆以太网、USB 3.0、USB2.0、MIPI CSI、UART Debug、TF 卡接口等。
模组搭载双频 2.4/5.0GHz 无线局域网和蓝牙 4.2 模块，单板上已具备 PCB 天线，同时也可以搭配外部天线套件使用，能够实现无线连接，降低用户开发和 测试成本，缩短上市时间。
RDK X3 Module 可选的板载 RAM 容量包括 2GB、4GB。
RDK X3 Moudle mainly includes a quad-core Cortex® A53 processor, 5Tops computing power, up to 4GB memory and supports 4K@60 frame video encoding and decoding; the main interfaces include HDMI, Gigabit Ethernet, USB 3.0, USB2.0, MIPI CSI, UART Debug, TF card interface, etc.
The module is equipped with dual-band 2.4/5.0GHz wireless LAN and Bluetooth 4.2 modules. The board already has a PCB antenna and can also be used with an external antenna kit to achieve wireless connections, reduce user development and testing costs, and shorten time to market.
The optional onboard RAM capacities of RDK X3 Module include 2GB and 4GB.
产品外观：
Product appearance：
| 正面 Front interface | 背面 Back interface |
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