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产品特点

产品功能

产品简介: 

Product introduction:


Leetop_ALP_681是基于英伟达AGX Orin 核心板研发的一款嵌入式人工智 能计算机, 能够为众多终端设备赋予高达200/275TOPS的计算力。 Jetson AGX Orin 可以和NVIDIA强大的AI软件堆栈/SDK及软件平台相结合,作为高性 能低功耗的嵌入式边缘计算设备,主要应用于制造、物流、零售、服务、农业、 智慧城市、医疗保健、生命科学等领域的先进人工智能机器人、边缘检测设备和 A I应用场景. Leetop_ALP_681提供快速的被动散热设计, 可以满足抗震防静电 等工业标准。 同时Leetop_ALP_681接口丰富性价比高。


Leetop_ ALP_ 681 is an embedded artificial intelligence developed based on the NVIDIA AGX Orin core module Capable of computing, capable of providing up to 200/275TOPS of computing power to numerous terminal devices. Jetson AGX Orin can be combined with NVIDIA's powerful AI software stack/SDK and software platform for high performance Embedded edge computing equipment with low power consumption, mainly used in manufacturing, logistics, retail, service, agriculture Advanced artificial intelligence robots, edge detection equipment, and A I application scenario Leetop_ ALP_ 681 provides a fast passive heat dissipation design that can meet seismic and anti-static requirements Industrial standards. Meanwhile, Leetop_ ALP_ 681 interface is rich and cost-effective.


产品规格 Product specification: 

处理器模块 Processor module:


specifications
ModuleJetson AGXOrin 32GBJetson AGX Orin 64GB
AI Performance200 TOPS275 TOPS
CPU

1792-core NVIDIA Ampere

GPU

 with56 Tensor Core

2048-core NVIDIA Ampere

GPU with 64 Tensor Cores

GPU

8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit

CPU2MB L2 + 4MB L3

12-core NVIDIA Arm® Cortex A78AE v8.2 64-

bit CPU

3MB L2 + 6MB L3

Memory

32 GB 256-bit LPDDR5

204.8 GB/s

64GB 256-bit LPDDR5

204.8 GB/s

Storage64GB eMMC 5.1
Video Encode

1x 4K60 (H.265) 3x 4K30 (H.265)

6x 1080p60 (H.265)

12x 1080p30 (H.265)

2x 4K60 (H.265) 4x 4K30 (H.265)

8x 1080p60 (H.265)

16x 1080p30 (H.265

Video Decode

1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265)

9x 1080p60 (H.265)

18x 1080p30 (H.265)

1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265)

11x 1080p60 (H.265) 22x 1080p30 (H.265)

Powerv15W - 40W15W - 60W


产品规格 Product specification:

InterfaceSpecification
Network1x Gigabit Ethernet(10/100/1000)
1x10G
USB

4x USB 3.0 Type A (Integrated USB 2.0)

1x USB 2.0+3.0 Type C

Video output1 × HDMI
Audio1 x Audio
20PIN IO CON20PIN Multifunction
SIM_Card1xSIM_Card
TF_Card1xTF_Card
GMSL1xGMSL
Function key

1x Power key; 1xRecovery key ;

1xReset key;


ProjectSpec
Input Voltage

+12(16A)---+36V(140W)

DC Input

Load capacityAbove  90W
Dimensions (W×D ×H)221x166x62(mm)
Operating Temperature-25℃-65℃
Storage Temperature/Humidity-25℃-65℃/10% -90% non condensation environment
Weight1.06595KG


尺寸示意图:

Schematic diagram of dimensions:

正视图  Front  view左视图  Left  view
image.pngimage.png
俯视图  Up  view后 视 图  Rear    view
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