产品特点
产品功能
产品简介： Product introduction:
Leetop_A612是基于英伟达Orin NANO/Orin NX核心板 研发一款高性能载板。Leetop_A612载板具有丰富的接口， 并能为的众多终端设备赋予高达20/40/70/100TOPS算力。 此外Leetop_A612提供丰富的外围接口。符合抗震防静电等 工业标准。
Leetop_A612 is a high-performance carrier board developed based on the NVIDIA Orin NANO/Orin NX core module. Leetop_ A612 carrier board has rich interfaces and can provide up to 20/40/70/100TOPS computing power for numerous terminal devices. In addition, Leetop_A612 provides rich peripheral interfaces. Comply with industrial standards such as earthquake resistance and anti-static.
产品规格 Product specification：
处理器模块 Processor module：
| Jetson Orin NX 8GB | Jetson Orin NX 16GB | |
| AI Performance | 70 TOPS | 100 TOPS |
| GPU | 1024-core NVIDIA Ampere GPU with 32 Tensor Cores | |
| CPU | 6-core NVIDIA Arm® CortexA78AE v8.2 64-bit CPU 1.5MBL2 + 4MB L3 | 8-core NVIDIA Arm ® Cortex A78AE v8.2 64-bit CPU 2MB L2+ 4MB L3 |
| Video Encode | 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Video Decode | 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) 1x 4K60 | 2x 4K30 | 5x 1080p60 | 11x 1080p30 (H.264) | |
| Memory | 8 GB 128-bit LPDDR5 102.4 GB/s | 16 GB 128-bit LPDDR5 102.4 GB/s |
| Storage | — (Supports external NVMe) | |
| Jetson Orin Nano 4GB | Jetson Orin Nano 8GB | |
| AI Performance | 20TOPS | 40TOPS |
| GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
| CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | |
| Video Encode | 1080p30 supported by 1-2 CPU cores | |
| Video Decode | 1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) | |
| Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s |
| Storage | — (Supports external NVMe) | |
产品规格 ：
Product specification：
| Project | Specification |
| Module Compatibility | Jetson Orin NANO/Orin NX |
| Display | 1x Mini HDMI |
| Ethernet | 1x Gigabit Ethernet (10/100/1000) |
| USB | 2x USB 3.0 3x USB2.0 1x USB 3.0 Type C |
| M.2 KEY M | 1xM.2KEY M (SSD) Interface 1xM.2KEY E(WIFI) Interface 1xM.2 KEY B(4G/5G) Interface |
| Camera | 2x CSI Camera |
| FAN | 1xFAN(5V PWM) |
| RTC CON | 1x3.0V RTC |
| CAN | 1xCAN(FD) |
| Audio | 2x SPEAKER; 1x SPEAKER FEEDBACK |
| Function con | 2x IIC; 1x SPI; 2x UART; 1x CAN; 1x I2ST; 1x SPK_R; 1x SPK_L 1x Recovery;1x SYS_RST; 1x USB |
| DC | Power interface |
| Project | Specification |
| Input Voltage | +9-- +20V(MAX 60W) DC Input |
| Load capacity | Above 60W |
| Dimensions (W×D ×H) | 90x70 (mm) |
| Operating Temperature | -25℃-65℃ |
Storage Temperature Humidity | -25℃-65℃ 10% -90% Non condensation environment |
| Weight | 0.05645KG |